FS2

FS2, Future Semiconductor 2D Materials, a startup founded by Dr. Sanghoon Bae and Prof. Jeehwan Kim at MIT, focuses on 2D materials and 3D chip integration. FS2’s core technology centeres on 3D compute using stacked layers of 2D materials, facilitated by a process called van der Waals assembly. This novel method aims to build chips upward rather than outward, addressing the semiconductor industry’s transistor density limits. By stacking tens or hundreds of nano layers, FS2 aims to double the density of chip components, integrating logic and memory in a seamless 3D structure. This innovative approach promises faster performance, greater storage capacity, and energy efficiency, potentially revaling the power of today’s supercomputers in a smaller package. The company aims for 8 inch wafer demo in 2025.

Co-Founders: Sanghoon Bae, Jekyung Kim, and Jeehwan Kim